MTech Asic Design syllabus for 1 Sem 2018 scheme 18EVE12

Module-1 Module-1 10 hours

Introduction to ASICs:

Full custom, Semi-custom and Programmable ASICs, ASIC Design flow, ASIC cell libraries.

 

CMOS Logic:

Data path Logic Cells: Data Path Elements, Adders: Carry skip, Carry bypass, Carry save, Carry select, Conditional sum, Multiplier (Booth encoding), Data path Operators, I/O cells, Cell Compilers.

Module-2 Module-2 10 hours

ASIC Library Design: Logical effort:

Predicting Delay, Logical area and logical efficiency, Logical paths, Multi stage cells, Optimum delay and number of stages, library cell design.

 

Programmable ASIC Logic Cells:

MUX as Boolean function generators, Acted ACT: ACT 1, ACT 2 and ACT 3 Logic Modules, Xilinx LCA: XC3000 CLB, Altera FLEX and MAX, Programmable ASIC I/O Cells: Xilinx and Altera I/O Block.

A d v e r t i s e m e n t
Module-3 Module-3 10 hours

Low-level design entry:

Schematic entry: Hierarchical design, The cell library, Names, Schematic Icons & Symbols, Nets, Schematic Entry for ASICs, Connections, vectored instances & buses, Edit in place, attributes, Netlist screener.

 

ASIC Construction:

Physical Design, CAD Tools System partitioning, Estimating ASIC size.

 

Partitioning:

Goals and objectives, Constructive Partitioning, Iterative Partitioning Improvement, KL, FM and Look Ahead algorithms.

Module-4 Module-4 10 hours

Floor planning and placement:

Goals and objectives, Measurement of delay in Floor planning, Floor planning tools, Channel definition, I/O and Power planning and Clock planning.

 

Placement:

Goals and Objectives, Min-cut Placement algorithm, Iterative Placement Improvement, Time driven placement methods, Physical Design Flow.

Module-5 Module-5 10 hours

Routing:

Global Routing: Goals and objectives, Global Routing Methods, Global routing between blocks, Back-annotation. Detailed Routing: Goals and objectives, Measurement of Channel Density, Left-Edge Algorithm, Area-Routing Algorithms, Multilevel routing, Timing –Driven detailed routing, Final routing steps, Special Routing, Circuit extraction and DRC.